Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960831 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Albert Wu, Kevin Jeng, Krishna Seshan | 2011-06-14 |
| 7886813 | Thermal interface material with carbon nanotubes and particles | James G. Maveety | 2011-02-15 |