Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7972683 | Wafer bonding material with embedded conductive particles | Christopher S. Gudeman, Ian R. Johnston | 2011-07-05 |
| 7968986 | Lid structure for microdevice and method of manufacture | Hung D. Nguyen | 2011-06-28 |