Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969018 | Stacked semiconductor chips with separate encapsulations | Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Kwai Hong Wong | 2011-06-28 |
| 7939381 | Method of semiconductor packaging and/or a semiconductor package | — | 2011-05-10 |