Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7875968 | Leadframe, semiconductor package and support lead for bonding with groundwires | Wu Hu Li, Mohamad Yazid Bin WAGIMAN | 2011-01-25 |
ML
Min Wee Low
Overall (2011): #213,530 of 364,097Top 60%
1
Patents 2011