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Florian Binder

QA Qimonda Ag: 3 patents #16 of 244Top 7%
Infineon Technologies Ag: 2 patents #152 of 900Top 20%
📍 Traunstein, DE: #1 of 7 inventorsTop 15%
Overall (2011): #49,515 of 364,097Top 15%
3
Patents 2011

Issued Patents 2011

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8048801 Substrate with feedthrough and method for producing the same Stephan Dertinger, Alfred Martin, Barbara Hasler, Grit Sommer 2011-11-01
7977798 Integrated circuit having a semiconductor substrate with a barrier layer Stephan Dertinger, Alfred Martin, Barbara Hasler, Grit Sommer 2011-07-12
7911026 Chip carrier with reduced interference signal sensitivity Thomas Haneder, Judith Lehmann, Manfred Schneegans, Grit Sommer 2011-03-22