PL

Pak Leung

Infineon Technologies Ag: 1 patents #300 of 900Top 35%
UM United Microelectronics: 1 patents #85 of 300Top 30%
IBM: 1 patents #3,726 of 9,568Top 40%
📍 Sha Tin, TX: #1 of 2 inventorsTop 50%
Overall (2011): #198,550 of 364,097Top 55%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7875544 Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation Robert C. Wong, Ernst Demm, Alexander Hirsch 2011-01-25