Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955967 | Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias | Douglas C. La Tulipe, Jr. | 2011-06-07 |
| 7919379 | Dielectric spacer removal | Eduard A. Cartier, Rashmi Jha, Sivananda K. Kanakasabapathy, Xi Li, Renee T. Mo +6 more | 2011-04-05 |