Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7946763 | Multi-layered thermal sensor for integrated circuits and other layered structures | Aquilur Rahman | 2011-05-24 |
| 7863724 | Circuit substrate having post-fed die side power supply connections | Daniel Douriet, Francesco Preda, Brian L. Singletary | 2011-01-04 |