Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8061212 | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby | — | 2011-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8061212 | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby | — | 2011-11-22 |