Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058708 | Through hole interconnection structure for semiconductor wafer | — | 2011-11-15 |
| 8048763 | Semiconductor device manufacturing method | Nobuaki Miyakawa, Takahiro Kimura | 2011-11-01 |
| 8049296 | Semiconductor wafer | Nobuaki Miyakawa, Takahiro Kimura | 2011-11-01 |
| 8026612 | Semiconductor device and method of manufacturing semiconductor device | Nobuaki Miyakawa | 2011-09-27 |
| 8022525 | Semiconductor device and method of manufacturing semiconductor device | Nobuaki Miyakawa | 2011-09-20 |
| 7986045 | Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers | Nobuaki Miyakawa | 2011-07-26 |