Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939938 | Functional device package with metallization arrangement for improved bondability of two substrates | Shohei Hata, Naoki Matsushima, Eiji Sakamoto, Ryoji Okada, Takanori Aono +1 more | 2011-05-10 |