Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7984545 | Approaches for manufacturing a head gimbal assembly | Yuhsuke Matsumoto, Hideto Imai, Tamaki Ushimoto | 2011-07-26 |
| 7893534 | Thermally insulating bonding pad structure for solder reflow connection | Toshiki Hirano, Haruhide Takahashi | 2011-02-22 |