TS

Tomokazu Shimada

TM Tessera Interconnect Materials: 1 patents #1 of 3Top 35%
Overall (2011): #141,100 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7923828 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element Kimitaka Endo, Norihito Masuda 2011-04-12