Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7981977 | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler | Kazuyoshi Tendou, Shinsuke Hagiwara | 2011-07-19 |
| 7982322 | Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same | Shinsuke Hagiwara, Kazuyoshi Tendou | 2011-07-19 |