PC

Pai-Sheng Cheng

HL Himax Technologies Limited: 1 patents #39 of 107Top 40%
Overall (2011): #199,918 of 364,097Top 55%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7906374 COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof Chiu-Shun Lin 2011-03-15