Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013434 | Thin double-sided package substrate and manufacture method thereof | Chi Chih Lin, Hung-Jen Wang, Jen Feng Tseng | 2011-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013434 | Thin double-sided package substrate and manufacture method thereof | Chi Chih Lin, Hung-Jen Wang, Jen Feng Tseng | 2011-09-06 |