Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071275 | Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods | Paul William Dryer, Andrew McNees | 2011-12-06 |
| 7938513 | Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips | Frank Edward Anderson, Paul William Dryer, Burton Lee Joyner, II, Andrew McNees, Timothy Strunk +1 more | 2011-05-10 |