Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923303 | Method of resin sealing electronic part | Izumi Kobayashi, Naoyuki Watanabe, Susumu Moriya, Toshiyuki Honda, Noboru Hayasaka | 2011-04-12 |
| 7888258 | Forming method of electrode and manufacturing method of semiconductor device | Hiroyuki Matsui, Yutaka Makino | 2011-02-15 |
| 7884459 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Koji Sawahata, Masataka Mizukoshi, Takao Nishimura +2 more | 2011-02-08 |