Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065793 | Method of encapsulating an electronic component | Junzou Une, Jun Matsueda | 2011-11-29 |
| 7938160 | Ultrasonic bonding apparatus | Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Taizan Kobayashi, Toshinori Kasuga | 2011-05-10 |
| 7905268 | Ultrasonic bonding apparatus | Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Taizan Kobayashi, Toshinori Kasuga | 2011-03-15 |