Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035037 | Core substrate and method of producing the same | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa +2 more | 2011-10-11 |
| 8023268 | Printed circuit board unit and semiconductor package | Kenji Fukuzono | 2011-09-20 |
| 7999193 | Wiring substrate and method of manufacturing the same | Katsuya Fukase, Kishio Yokouchi | 2011-08-16 |