Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982293 | Multi-chip package including die paddle with steps | Weng Shyan Aik | 2011-07-19 |
WC
Wei Kee Chan
Overall (2011): #133,537 of 364,097Top 40%
1
Patents 2011