Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8016183 | Adjustable clamp system and method for wire bonding die assembly | Sik Pong Lee | 2011-09-13 |
| 7956471 | Mold and substrate for use with mold | Poh Leng Eu, Boon Yew Low | 2011-06-07 |