Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062424 | Method and apparatus for molding substrate | Vermal Raja Manikam, Boon Yew Low | 2011-11-22 |
| 7989965 | Underfill dispensing system for integrated circuits | Yit Meng Lee, Vemal Raja Manikam | 2011-08-02 |