Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003517 | Method for forming interconnects for 3-D applications | Varughese Mathew, Eddie Acosta, Sam S. Garcia | 2011-08-23 |
| 7993971 | Forming a 3-D semiconductor die structure with an intermetallic formation | Eddic Acosta, Varughese Mathew | 2011-08-09 |
| 7932175 | Method to form a via | Eddie Acosta, Sam S. Garcia, Varughese Mathew | 2011-04-26 |