Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053905 | Compliant bonding structures for semiconductor devices | John E. Epler, Michael R. Krames, James G. Neff | 2011-11-08 |
| 7977132 | Extension of contact pads to the die edge via electrical isolation | Tal Margalith, Henry Kwong-Hin Choy | 2011-07-12 |