Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067826 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | Joon-seo Son, Taek-keun Lee, Byoung-ok Lee | 2011-11-29 |
| 7951645 | Power module for low thermal resistance and method of fabricating the same | Keun-hyuk Lee, Seung-won Lim | 2011-05-31 |