Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8002962 | Copper electrodeposition in microelectronics | Xuan Lin, Paul Figura, Richard Hurtubise | 2011-08-23 |
| 7998859 | Surface preparation process for damascene copper deposition | Qingyun Chen, Xuan Lin, Richard Hurtubise, Joseph A. Abys | 2011-08-16 |
| 7968455 | Copper deposition for filling features in manufacture of microelectronic devices | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2011-06-28 |