Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039318 | System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices | Randall D. Briggs | 2011-10-18 |
| 8021928 | System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices | Randall D. Briggs | 2011-09-20 |
| 7977773 | Leadframe including die paddle apertures for reducing delamination | — | 2011-07-12 |
| 7902655 | Multichip package leadframe including electrical bussing | — | 2011-03-08 |