Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026597 | Fluid cooled encapsulated microelectronic package | Suresh K. Chengalva, Thomas A. Degenkolb | 2011-09-27 |
SB
Scott D. Brandenburg
Overall (2011): #172,399 of 364,097Top 50%
1
Patents 2011