Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017445 | Warpage-compensating die paddle design for high thermal-mismatched package construction | Carlo Gamboa | 2011-09-13 |
| 7939371 | Flip-flop semiconductor device packaging using an interposer | — | 2011-05-10 |
| 7939372 | Semiconductor device packaging using etched leadfingers | — | 2011-05-10 |