| #75 |
Jian Xu |
IBM |
2 |
| #75 |
Zhihui Wang |
BOE |
2 |
| #75 |
Tao Jing |
Integrated Device Technology |
2 |
| #75 |
Li Zhou |
IBM |
2 |
| #75 |
Rui-fang Shi |
Kla-Tencor |
2 |
| #75 |
Ke Sun |
Foxconn |
2 |
| #75 |
Hui-Quan Han |
Amgen |
2 |
| #75 |
Wenhua Sun |
Huawei |
2 |
| #75 |
Wei Zhang |
Western Digital (Fremont) |
2 |
| #75 |
Yan Ren |
BOE |
2 |
| #75 |
Liang-Yuh Chen |
Applied Materials |
2 |
| #75 |
Lei Gao |
IBM |
2 |
| #75 |
Xinyu Wang |
Sungrow Power Supply Co. |
2 |
| #75 |
Haibin Chen |
Codexis |
2 |
| #75 |
Yao-Tian Wang |
Ricoh Company |
2 |
| #75 |
Xiangrong Wang |
Cisco |
2 |
| #75 |
Han-Jie Zhou |
Onyx Therapeutics |
2 |
| #75 |
Hao-Hua Chu |
Ntt Docomo |
2 |
| #75 |
Yang Jiao |
Via Technologies |
2 |
| #75 |
Jian Gao |
Emc Ip Holding Company |
2 |
| #75 |
Weilin Wang |
Shanghai Zhaoxin Semiconductor Co. |
2 |
| #75 |
Qi Wu |
Broadcom |
2 |
| #75 |
Lei Wan |
Huawei |
2 |
| #75 |
Yang Yu |
IBM |
2 |
| #75 |
Xin Peng Liu |
IBM |
2 |
| #75 |
Heng Xu |
Bank of America |
2 |
| #75 |
Song Liu |
Goertek |
2 |
| #75 |
Qi Wang |
Apple |
2 |
| #75 |
Rong Xiang |
Scripps Research |
2 |
| #75 |
Fang Yu |
Huawei |
2 |
| #131 |
Ping Yuan |
The Boeing |
1 |
| #131 |
Jie Han |
BOE |
1 |
| #131 |
Wei Sun |
Honeywell |
1 |
| #131 |
Ying Wang |
Qualcomm |
1 |
| #131 |
Haifeng Xu |
BOE |
1 |
| #131 |
Xiaodong Han |
Beijing University Of Technology |
1 |
| #131 |
Zhao Li |
BOE |
1 |
| #131 |
Huarui Liang |
Apple |
1 |
| #131 |
Yuliang Wang |
Institute Of Geology And Geophysics, Chinese Academy Of Sciences |
1 |
| #131 |
Ying Cao |
IBM |
1 |
| #131 |
Jiong Wang |
Microsoft |
1 |
| #131 |
Yue Liu |
BOE |
1 |
| #131 |
Fan Ling |
Qualcomm |
1 |
| #131 |
Hua Lin |
Nec |
1 |
| #131 |
Weimin Ma |
Hangzhou Hikvision Digital Technology Co. |
1 |
| #131 |
Yuming Hu |
Capitalbio |
1 |
| #131 |
Pei Li |
Beijing Boe Multimedia Technology Co. |
1 |
| #131 |
Haiyu Zhao |
Sensetime International Pte. |
1 |
| #131 |
Yao Rong |
Nutanix |
1 |
| #131 |
Chentao Yu |
Lenovo (Beijing) Limited |
1 |