Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7972650 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Kenneth H. Church, Patrick Clark, Dongjiang Xu, Lance Swan, Bryan Andrew Irwin | 2011-07-05 |