Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863758 | Adhesive film composition, associated dicing die bonding film, and die package | Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Ho Jeong, Ah Ram Pyun +2 more | 2011-01-04 |