Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067274 | Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method | Takeshi Wakabayashi | 2011-11-29 |
| 7867826 | Semiconductor device packaged into chip size and manufacturing method thereof | Takeshi Wakabayashi | 2011-01-11 |