Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8042727 | Heater, reflow apparatus, and solder bump forming method and apparatus | Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Masahiko Furuno, Haruhiko Ando +1 more | 2011-10-25 |