William J. Lypen

AP Avago Technologies Wireless Ip (Singapore) Pte.: 1 patents #8 of 38Top 25%

📍 Windsor, CO: #9 of 27 inventorsTop 35%

🗺 Colorado: #1,055 of 3,647 inventorsTop 30%

Overall (2011): #130,676 of 364,097Top 40%

Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
7977799	Planar packageless semiconductor structure with via and coplanar contacts	Rick Snyder	2011-07-12