Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044526 | Integrated circuit assemblies with alignment features and devices and methods related thereto | — | 2011-10-25 |
| 8022516 | Metal leadframe package with secure feature | Julius Kovats | 2011-09-20 |
| 8018065 | Wafer-level integrated circuit package with top and bottom side electrical connections | — | 2011-09-13 |
| 7981796 | Methods for forming packaged products | — | 2011-07-19 |
| 7932590 | Stacked-die electronics package with planar and three-dimensional inductor elements | — | 2011-04-26 |
| 7927918 | Packaged products, including stacked package modules, and methods of forming same | — | 2011-04-19 |
| 7880193 | Method for forming an integral electromagnetic radiation shield in an electronic package | — | 2011-02-01 |