Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952186 | Semiconductor package land grid array substrate and plurality of first and second electrodes | — | 2011-05-31 |
| 7944036 | Semiconductor device including mounting board with stitches and first and second semiconductor chips | — | 2011-05-17 |
| 7888805 | Semiconductor device package of stacked semiconductor chips with spacers provided therein | — | 2011-02-15 |
| 7878533 | Airbag device | Yoshio Shimazaki, Seiichiro Kamura, Hiroyuki Taniyama | 2011-02-01 |
| 7867884 | Sample wafer fabrication method | Tomohiro Kamimura, Tomoharu Inoue | 2011-01-11 |