Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939916 | Wafer level CSP packaging concept | Alan J. O'Donnell, Oliver Kierse | 2011-05-10 |
| 7871865 | Stress free package and laminate-based isolator package | Dipak Sengupta | 2011-01-18 |