Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994043 | Lead free alloy bump structure and fabrication method | J. Daniel Mis | 2011-08-09 |
| 7932615 | Electronic devices including solder bumps on compliant dielectric layers | — | 2011-04-26 |
| 7879715 | Methods of forming electronic structures including conductive shunt layers and related structures | Krishna K. Nair, William E. Batchelor | 2011-02-01 |
| 7871899 | Methods of forming back side layers for thinned wafers | Kevin Engel, Julia Roe, Chirstopher John Berry | 2011-01-18 |