Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026589 | Reduced profile stackable semiconductor package | Do Hyung Kim, Chan Ha Hwang, Min-Woo Lee, Eun Sook Sohn, Won Joon Kang | 2011-09-27 |
| 8004078 | Adhesive composition for semiconductor device | Jae Kyu Song, Min Yoo | 2011-08-23 |
| 7956453 | Semiconductor package with patterning layer and method of making same | Do Hyeong Kim, Yoon Joo Kim, Ji Young Chung | 2011-06-07 |
| 7938308 | Wire bonder for improved bondability of a conductive wire and method therefor | Joon Su Kim, Mun Gil Ho, Yong Suk Yang, Jung Soo Park | 2011-05-10 |
| 7906855 | Stacked semiconductor package and method of making same | Yoon Joo Kim, In Tae Kim, Ji Young Chung, Do Hyung Kim, Sung Chul Ha +2 more | 2011-03-15 |
| 7869836 | Power saving devices and power saving methods for mobile access point, and wireless network systems | — | 2011-01-11 |