Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8001511 | Methods of implementing and modeling interconnect lines at optional boundaries in multi-product programmable IC dies | Trevor J. Bauer, Jeffrey V. Lindholm, F. Erich Goetting, Bruce E. Talley, Steven P. Young | 2011-08-16 |