Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888259 | Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same | Roden R. Topacio | 2011-02-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888259 | Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same | Roden R. Topacio | 2011-02-15 |