MB

Mathias Bonse

AT Agilent Technologies: 1 patents #27 of 208Top 15%
🗺 California: #14,783 of 41,698 inventorsTop 40%
Overall (2011): #230,478 of 364,097Top 65%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7911066 Through-chip via interconnects for stacked integrated circuit structures Eric R. Ehlers, Jim Clatterbaugh, Timothy E. Shirley, Jerry Orr 2011-03-22