Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8025201 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles | Nelson Troncoso | 2011-09-27 |
| 7977804 | Ball-bump bonded ribbon-wire interconnect | Dale E. Christensen | 2011-07-12 |