Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2011-11-15 |
| 7993982 | Quad flat non-leaded package and manufacturing method thereof | — | 2011-08-09 |