Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035213 | Chip package structure and method of manufacturing the same | Shih-Kuang Chen, Yuan-Ting Chang | 2011-10-11 |
| 8022534 | Semiconductor package using an active type heat-spreading element | Tong-Hong Wang | 2011-09-20 |