Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053329 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2011-11-08 |
| 7956447 | Wafer scale die handling | Paul M. Enquist, Carl T. Petteway | 2011-06-07 |
| 7871898 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2011-01-18 |