Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058108 | Methods of forming semiconductor chip underfill anchors | Roden R. Topacio | 2011-11-15 |
| 7994044 | Semiconductor chip with contoured solder structure opening | Roden R. Topacio | 2011-08-09 |
| 7985621 | Method and apparatus for making semiconductor packages | Vincent Chan, Roden R. Topacio | 2011-07-26 |
| 7969020 | Die stacking apparatus and method | Vincent Chan, Kevin O'Neil | 2011-06-28 |
| 7906424 | Conductor bump method and apparatus | Roden R. Topacio, Yip Seng Low, Andrew KW Leung | 2011-03-15 |