CH

Chi-Hsing Hsu

VT Via Technologies: 5 patents #6 of 123Top 5%
📍 New Taipei, TW: #22 of 408 inventorsTop 6%
Overall (2004): #9,863 of 270,089Top 4%
5
Patents 2004

Issued Patents 2004

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
6809262 Flip chip package carrier 2004-10-26
6777804 Flip-chip package substrate 2004-08-17
6774498 Flip-chip package substrate Jimmy Hsu 2004-08-10
6740965 Flip-chip package substrate Jimmy Hsu 2004-05-25
6710459 Flip-chip die for joining with a flip-chip substrate 2004-03-23